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Tuttle Capital Memory Stack Income Blast ETF

21.60

+0.15640.73%

Volume:9K

Turnover:197.25K

Market Cap:6.26M

PE:- -

High:21.60

Open:21.54

Low:21.36

Close:21.44

52wk High:34.00

52wk Low:17.26

Shares:290.00K

Float Shares:290.00K

Volume Ratio:2.02

T/O Rate:3.17%

Dividend:2.30

Dividend Rate:10.64%

ROE:--

ROA:--

PB:--

PE(LYR):- -

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Overview Company News Filings

Market Chatter: Kioxia to Build 1 Trillion Yen NAND Flash Memory Production Facility in Northern Japan; Shares Up 5%

MT Newswires Live

CXMT Growth Outlook Brightens Amid Tight Memory Market

Is YMTC Poised to Follow in CXMT's Footsteps as the Next Memory Giant?

Glass Substrates Poised as Key Next-Gen Advanced Packaging Platform, Core Equipment Segments May Reap Initial Gains

Memory Prices Set to Account for Bigger Share of AI Infrastructure Budgets

Is HBM Holdings (SEHK:2142) Fully Valued After Its HBM7004 IND Approval?

Simply Wall St.

330亿融资目标：长江存储冲刺科创板最大IPO，65岁半导体元老陈南翔的关键布局

Washington Pressures Seoul to Expand Memory Chip Manufacturing in the US

How Micron is Fighting Off Another China Threat

Chinese Chipmaker YMTC Seeks $4.9B IPO on AI-Driven Growth

Goldman Sachs Lifts Global Fab Equipment Spending Forecasts Sharply, With Memory and Advanced Foundry Leading the Charge

HBM Holdings to Join Hang Seng Composite Index

MT Newswires Live

Hong Kong Memory Chip Stocks Plunge as Samsung Drops Nearly 8%, Leveraged Product Sinks 16%

HBM Holdings to Join Hang Seng Composite Index, Aiming to Boost Liquidity and Investor Reach

Memory Manufacturing's Material Shift: Why Molybdenum is Replacing Tungsten in Advanced 3D NAND

Capital Floods Into Semiconductor Upstream Assets As Memory Chip and Power Semiconductor Cycles Align

Surprise Boost! US Memory Chip Stocks Climb in Premarket Trading

SK hynix Launches Massive Treasury Share Buyback for Cancellation

Two Investment Experts Explain Why They Are Steering Clear of Memory Stocks

Analysts Offer Insights on Materials Companies: Royal Gold (RGLD) and Hudbay Minerals (HBM)

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Recently, the Shanghai Stock Exchange's official website showed that Yangtze Memory Technologies Co., Ltd.'s (YMTC) IPO application has been...","market":"other","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"express","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["TTXU","RAMZ","LU1674673691.USD","RULE","LU2750360641.GBP","IE000M9KFDE8.USD","BAI","LU0109392836.USD","HBMX","LU0820561909.HKD","LU2023250330.USD","LU2931357623.SGD","XLK","IE00BSNM7G36.USD","LU2168564222.USD","LU0157215616.USD","LU0127658192.USD","LU0708995401.HKD","VGT","LU0203345920.USD","LU0943347566.SGD","SG9999001424.SGD","LU0256863902.USD","DRAL","LU2471134523.USD","LU1868836591.USD","LU2290526834.HKD","LU0081259029.USD","LU2286300806.USD","IE00BK4W5M84.HKD","IE00BKDWB100.SGD","FAI","SGXZ51526630.SGD","LU0061475181.USD","SOXX","AIS","LU2048586759.USD","EMSF","LU1868837136.USD","LU2471134952.CNY","LU2750360997.AUD","BK4533","IXN","LU1861220033.SGD","SHOC","LU2360107168.USD","LU0889566641.SGD","LU2543165471.USD","IPOS","MULL","SMU00main","LU0238689110.USD","DISK","LU1914381329.SGD","LU2471134879.HKD","MIC","IE00B7SZLL34.SGD","IE0009356076.USD","AIFD","LU1861215975.USD","LU0964807845.USD","DRAM","LU0082616367.USD","LU0683600562.USD","IE00BWXC8680.SGD","LU1720051017.SGD","LU0820562030.AUD","BK4527","LU1868837300.USD","CGGO","IE00B19Z3B42.SGD","EGGY","LU2471134796.USD","LU1551013425.SGD","LU2357305700.SGD","LU1868836757.USD","LU2168564495.EUR","LU0640476718.USD","LEGR","USXF","LU0154236417.USD","LU2896262040.SGD","DRMP","BK4575","LU2756315664.SGD","MUYY","CHAT","LU0323591593.USD","LU1280957306.USD","BK4553","LU2102340556.USD","LU2168564149.EUR","LU2089985449.USD","TRFK","LU0689472784.USD","WLDR","BK4579","LU2756315318.SGD","LU1267930813.SGD","MU","LU0056508442.USD","LU0096364046.USD","EFIV","LU0792757196.USD","LU2360106780.USD","MUU","PTF","LU0274383776.USD","LU1868836914.USD","SMH","BK4554","AIQ","WUGI","CHPX","FDTX","LU0256863811.USD","LU2213496289.HKD","LU1629891620.HKD","LU1551013342.USD","LU1989764748.USD","MUG","LU0109391861.USD","LU0642271901.SGD","LU0820561818.USD","DRMY","XNTK","LU0889565833.HKD","SOXQ","LU1852331112.SGD","JGRO","MUZ","LU0133085943.USD","LU2458330169.SGD","FTXL","LU2168563687.JPY","LU0719512351.SGD","LU1323610961.USD","GB00BDT5M118.USD","LU1674673428.USD","BK4585","LU1989764664.SGD","CHPS","FTEC","IE00BK4W5L77.USD","LU1267930730.SGD","PSI","IE00B5949003.HKD","BK4512","IE00B1XK9C88.USD","BK4141","LU0787776722.HKD","LU0859254822.USD","LU1548497426.USD","LU2458330243.SGD","IE0034235303.USD","LU0203347892.USD","BK4543","LU0672654240.SGD","LU1316542783.SGD","IE00BJLML261.HKD","MUD","IE0002270589.USD","LU2211815571.USD","LU1720051108.HKD","ARTY","LU1778281490.HKD","BK4588","LU0210536198.USD","LU2250418816.HKD","FXL","LU1366333091.USD","LU0417517546.SGD","IETC","SGXZ99366536.SGD","IE00B19Z3581.USD","BK4605","BOBP","BK4532","LU2357627491.SGD","LU1145028129.USD","LU2054465674.USD","SGXZ81514606.USD","LU0320765059.SGD","BK4566","LU2403377893.USD","LU2168564065.EUR","LU1803068979.SGD"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"1175481850","title":"Glass Substrates Poised as Key Next-Gen Advanced Packaging Platform, Core Equipment Segments May Reap Initial Gains","url":"https://stock-news.laohu8.com/highlight/detail?id=1175481850","media":"Stock News","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/1175481850?lang=en_us&edition=fundamental","pubTime":"2026-08-27 07:48","pubTimestamp":1787788099,"startTime":"0","endTime":"0","summary":"A new report from CICC highlights that as AI large-chip packaging dimensions continue to scale up, glass substrates are emerging as a vital material platform for next-generation advanced packaging,...","market":"nz","thumbnail":"","type":0,"news_type":0,"thumbnails":[],"rights":null,"property":[],"language":"en","translate_title":"","themeId":null,"theme_name":"","theme_type":"","isJumpTheme":false,"source_url":"","is_publish_highlight":false,"source_rank":0,"column":"","sentiment":"0","news_top_title":null,"news_tag":"","news_rank":0,"length":0,"strategy_id":0,"source":null,"symbols":["HBMX","BESIY","DRMP","AMKX","AMKL","BK4147","TCAI"],"isVideo":false,"video":null,"gpt_icon":0},{"id":"2662765934","title":"Memory Prices Set to Account for Bigger Share of AI Infrastructure Budgets","url":"https://stock-news.laohu8.com/highlight/detail?id=2662765934","media":"Dow Jones","labels":[],"top":-1,"itemType":null,"share":"https://ttm.financial/m/news/2662765934?lang=en_us&edition=fundamental","pubTime":"2026-08-26 08:46","pubTimestamp":1787705160,"startTime":"0","endTime":"0","summary":"0046 GMT - Memory prices are set to absorb an even larger share of cloud providers' AI infrastructure budgets in 2027, with DRAM and NAND flash projected to account for 68% of total capital expenditure, up from 47% in 2026, according to research firm TrendForce. Server DRAM prices are expected to rise about 270% in 2026, while prices for enterprise storage products could jump 235%, extending gains that began in the second half of 2025. 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